Established in 1994 as the first Outsourced Semiconductor Assembly and Test (OSAT) provider in Singapore, STATS ChipPAC Singapore (SCS) offers back-end manufacturing services for the semiconductor industry. SCS's state-of-the-art facility, at 808, 000 square feet, is the largest OSAT operation in Singapore, and offers a full suite of assembly solutions to meet our customer's IC packaging needs, from a wide array of advanced leadframe (QFN) and laminate based products (PBGA, PBGA-H, FBGA, LGA), to innovative wafer level packaging technologies.

STATS ChipPAC Singapore provides full turnkey solutions for advanced wafer level packaging (WLP), including Fan-out WLP (FOWLP), Fan-in WLP, Through Silicon Via (TSV), 2.5D and 3D packaging solutions. SCS's wafer level services also include full service wafer bumping (WLB) with options for repassivation, redistribution and Integrated Passive Devices (IPDs). For a full turnkey solution, STATS ChipPAC offers a full suite of test platforms and engineering services to support a broad range of mixed signal, RF, analog and high-performance digital semiconductor devices.